Qualcomm announced in Embedded World 2024 two important news. One of them is the Qualcomm RB3 Gen 2 platform, a hardware and software solution designed for robotics, Internet of Things (IoT), and embedded applications. This platform is based on the Qualcomm QCS6490 processor.
La RB3 Gen 2 platform offers high performance thanks to its eight-core processor and 12 TOPS of artificial intelligence (AI) capacity. In addition, it has 6GB of RAM and 128GB of storage to ensure smooth operation of applications.
This is a great step for the development of smart devices and more powerful and efficient robots. And, thanks to Qualcomm's QCS6490 SoC, offers a huge leap in performance and artificial intelligence for embedded devices. While the QCS6490 had not been mentioned before, we did know about the QCM6490 with 5G modem for smartphones. Unlike the Android-focused QCM6490, the RB6490 Gen 3 platform QCS2 runs “Qualcomm Linux” with an LTS kernel and IoT software suite.
And you can find this RB3 Gen 2 to power robots, drones, portable or embedded industrial devices, and also for the IoT, bringing AI improvements to these sectors, and which you can buy now with a pre-order starting at $399. For this price you will have:
- Greater processing capacity- Delivers 10x more on-device AI processing than the previous RB3 platform.
- Support for multiple cameras and machine vision: allows you to use 8MP+ quad camera sensors and process images with computer vision.
- advanced connectivity- Integrates Wi-Fi 6E for a high-speed wireless connection.
- Wide compatibility- Runs on Qualcomm Linux and Android support is expected in the future. In addition, it offers several SDKs for development.
- Long useful life: Qualcomm guarantees 15 years of support for the QCS6490 processor, almost like automotive grade chips…
Technical characteristics of the Qualcomm RB3 Gen 2
As for the Technical specifications Of this Qualcomm RB3 Gen 2 board, we have to highlight the following:
- SoC:
- Qualcomm QCS6490 with 8 ARM processing cores with Kryo microarchitecture, Adreno GPU and Hexagon DSP AI accelerator.
- Principal memory:
- 6 GB of LPDDR4x RAM (uMCP package)
- Storage:
- 128GB UFS Flash (uMCP package)
- MicroSD card slot
- PCIe expansion slot for NVMe SSD
- Display
- HDMI connector
- USB Type-C with DP support
- mini DP
- DSI Expansion
- Up to 2x simultaneous screens
- Camera:
- Core Kit: 2x C-PHY/D-PHY 30-pin for on-board expansion
- Vision Kit: 1x IMX577 D-PHY 12 MP, 1x OV9282 D-PHY 1 MP with braket, and additional D-PHY and GMSL expansion port
- Audio
- Core Kit: 1x DMIC, 2x digital amplifiers, I2S/Soundwire/DMIC low speed connector
- Vision Kit: 4x DMIC, 2x digital amplifiers, I2S/Soundwire/DMIC low speed connector
- Social
- Wireless 802.11ax WiFi 6E with DBS up to 3.6 Gbps
- Bluetooth 5.2 with support for LE audio
- 2x antennas printed on PCB, RF expansion connector for optional external antennas
- USB ports:
- 1x USB 3.0 Type-C
- 1x USB 2.0 w/OTG
- 2x USB 3.0 Type A
- 1x USB 3.0 Hi-Speed
- PCIe interface:
- 1x PCIe Gen 3 2-lane for expansion
- 1x PCIe Gen 3 1-lane for optional expansion
- Sensors:
- Core Kit: Integrated IMU (ICM-42688), additional expansion
- Vision Kit: IMU (ICM-42688), pressure sensor (ICP-10111), magnetic/compass sensor (AK09915), additional expansion
- Expansion:
- Low and high speed connectors for Mezzanines (96boards)