Thermal paste: he aha ia, ʻano, pehea e hoʻohana ʻia ai ...

ʻōhua wela

La ʻōhua wela he mea hoohana nui ia ma ka honua o ka uila. ʻO ka maʻamau ma ke ʻano he interface e hoʻomaikaʻi ai i ka hoʻoheheʻe ʻana o ka wela ma waena o nā ʻāpana hana kiʻekiʻe a me nā heatsinks. Akā, ʻaʻole ia wale nō kahi i hoʻohana ʻia, hiki ke hoʻohana ʻia no nā transistors mana kiʻekiʻe, i nā papa hopena peltier, Etc.

Ma kēia ʻatikala e ʻike ʻoe He aha kēia mea, ʻO kāna hana, pehea e hoʻohana pono ʻia ai, nā ʻano i loaʻa i ka mākeke a me nā hōʻailona maikaʻi loa āu e kūʻai ai.

He aha ka thermal paste?

ʻōhua wela

Hiki ke kapa ʻia ma nā ʻano he nui: paʻi wela, silicone thermal, momona momona, etc. He like kēia mau huaʻōlelo a pau, ʻaʻohe ʻokoʻa ma waena o lākou. Hōʻike i kahi mea i loaʻa nā waiwai conductivity wela maikaʻi e kōkua i ka hoʻopau maikaʻi ʻana i ka wela ke loaʻa ka pilina ma waena o nā ʻili ʻelua. No ka laʻana, ke hoʻohana ʻia ka heatsink ma luna o kahi puʻupuʻu, e hoʻopiha i nā "ākea" ma waena o kekahi ʻaoʻao a me kekahi a pēlā e ʻoi aku ka maikaʻi o ka lawe ʻana.

Loaʻa nā mea ʻokoʻa o ka thermal paste i kāna ʻano:

  • ʻO ka matrix wai polymerizable: ʻo ia ke kumu o ka paʻi, ka mea i lilo i mea wai. ʻO ka maʻamau, hoʻokumu ʻia kēia mau ʻano gels a i ʻole pastes ma luna o nā silicones (no laila ko lākou inoa), epoxy resins, acrylates, urethanes, etc., a hiki ke hoʻonohonoho ʻia i loko o nā adhesives a i ʻole nā ​​​​pads ma kahi o ka palapala paʻi.
  • Pāʻālua: ʻO kēia mau mea hoʻopihapiha e hōʻike pinepine ana ma waena o 70 a me 80% o ka hoʻohui ʻana o ka thermal paste. I kēia hihia, hiki iā lākou ke ʻano like ʻole, e like me ke keleawe, aluminika, kālā, zinc oxide, boron nitride, etc.

Ma muli o kēia haku mele ʻana, hiki ke hana ʻia kēia thermal paste ʻawaʻawa inā ale ʻia. No laila, pono e mālama ʻia i ka wā e hoʻohana ai, holoi lima inā mālama ʻia me ka ʻole o nā mīkina lima a pale i ka waiho ʻana i ka hiki ʻana o nā keiki. Eia kekahi, he mea hoʻonāukiuki i ka ʻili, nā maka, a me nā mucous membranes, no laila pono ʻoe e hoʻohana i nā mea pale i ka wā e lawelawe ai. Hōʻike kekahi mau haʻawina wikiō pehea e hoʻohana ai lākou me ka lima, akā ʻaʻole pono e hana ʻia kēia.

Inā ʻoe i mua o kahi mea uila hou, a ʻaʻole maopopo ʻoe inā hiki iā ʻoe ke hoʻohana i ka thermal paste ma luna o kona ʻili a i ʻole ka mea e hoʻohana ai, paipai wau iā ʻoe e heluhelu mau i ka nā mea hana ʻikepili. Ma kēia palapala e ʻike ʻoe i ka ʻike e pili ana iā ia, me ka hoʻohui ʻana i nā pono dissipation, ka mana, ka palena kiʻekiʻe a me ka liʻiliʻi o nā mahana i kākoʻo ʻia, nā waiwai e like me junction-case, junction-air, etc.

Nā Kuleana

CPU

ʻAʻole i loaʻa wale ka thermal paste nā mea waiwai o ka thermal conductivity, akā ʻo nā mea ʻē aʻe, a pono e nānā pono iā lākou, no ka mea hiki iā lākou ke hoʻonohonoho i ka hoʻohana e like me nā mea uila. Hōʻike nui ʻia kēia mea e:

  • ʻO ke kau wela wela: ʻO ia ka mea koʻikoʻi i loko o ka paʻi wela, ʻoiai he mea ia e hoʻopau i ka wela. No laila, pono e loaʻa iā lākou ka mana maikaʻi e lawe i ka wela. Hoʻohana ʻia nā ʻāpana e like me watt per mika-Kelvin e ana i kēia helu. Ma muli o ke ʻano o ka pasta a i ʻole ka brand, hiki ke ʻokoʻa kēia conductivity. No ka laʻana, ʻo nā mea o ke keleawe, ke kālā, ke daimana a i ʻole ke alumini he mau waiwai maikaʻi loa ma kēia ʻano, ʻo nā mea ʻē aʻe e like me ka zinc oxide, aluminum nitride, etc., ʻaʻole nui loa.
  • Ka hoʻokuʻu uila: Ua pili ia i kekahi o na pilikia e hiki ai ke hooulu mai i ka wela ina e holo maikai ana ka uila. ʻO ka mea maʻamau, hōʻike nā mea hana pasta i ke kūpaʻa uila i hōʻike ʻia e kā lākou huahana. ʻO ke kiʻekiʻe (ohms per centimeter), ʻoi aku ka maikaʻi o ka insulator, no laila hiki ke ʻoi aku ka maikaʻi. Inā he haʻahaʻa ka pale a holo maikaʻi ka paʻi a laila hiki ke alakaʻi i nā pilikia kaapuni pōkole inā pili ia me kekahi mau mele a i ʻole nā ​​pine.
  • Koefficient dilatation Thermic: ʻo ia ka ʻāpana ʻē aʻe e hoʻolohe ai. I kēia hihia, pono ʻoe e ʻimi i kahi paʻi nona ka coefficient ka haʻahaʻa haʻahaʻa loa, ʻo ia hoʻi, e hoʻonui liʻiliʻi me ka wela. Inā ʻaʻole, hiki iā ia ke hoʻoulu i nā pilikia ʻino ma waena o nā ʻāpana.

Nā ʻano ʻaila ʻaila

pā hoʻomehana

Nui nā ʻano o ka thermal paste ma ka mākeke, a he mea nui ia e hoʻokaʻawale i waena o nā hopena āpau i loaʻa e ʻike i ka mea e koho ai i kēlā me kēia hihia, no ka mea, aia lākou āpau. nā pono a me nā ponoʻole:

  • Papa hoʻomehana: he mea hoʻopili a pad paha e hana like me ka wela conductive interface a ua like kona kumu me ka thermal paste, akā hiki ke hoʻohana maʻalahi, ʻaʻole ia e pili i ka hoʻomalu ʻana i ka nui, e hōʻoia i ka hoʻonui ʻana i ka homogeneously, etc., no ka mea, pili wale ia ma ka ʻili o ka mea e hoʻoheheʻe ʻia a i ʻole ma ka heatsink. Ua kūʻai ʻia lākou ma kahi kaʻawale, ʻoiai ke hele mai nei lākou i hoʻokomo mua ʻia i kekahi mau ʻōnaehana refrigeration e hoʻomaʻamaʻa i ka hui. Hana ʻia kēia me ka silicone a i ʻole ka paraffin wax i hui pū ʻia me nā ʻāpana conductive paʻa. Ma ka lumi wela, ʻoi aku ka paʻa o lākou, akā i ka wā e hana ana, lilo lākou i wai.
  • Pā hoʻopili wela: ʻo ia ka mea wai ʻawaʻawa i kūʻai ʻia i loko o nā kini me ka pulupulu noi, nā paipu a i ʻole nā ​​syringes no ka hoʻohana maʻalahi. I loko o kēia paʻi hiki iā ʻoe ke loaʻa nā ʻano ʻano:
    • O ka hao: hoʻohana lākou i nā ʻāpana metala (zinc, keleawe, aluminika, kālā, gula ...) no ka hoʻopiha ʻana, a loaʻa iā lākou kahi kala hina. Ua kaulana loa lākou, a ʻaʻole nui ke kumukūʻai. Hana maikaʻi lākou ma ke ʻano o ka conductivity thermal, hiki ke hoʻohaʻahaʻa i ka mahana a hiki i 6ºC i kekahi mau hihia. Eia nō naʻe, pilikia lākou, a ʻo kā lākou conductivity uila. Me nā ʻāpana metala, hiki iā ia ke hoʻokaʻawale pōkole ma waena o nā mea pili inā he leak.
    • Nā keramika: ʻO nā ʻāpana hoʻopihapiha he seramika (zinc oxide, silicon dioxide, alumini oxide, ...), hāʻawi i nā kala hina hina a keʻokeʻo paha. ʻO ke kumu ikaika o kēia mau silicones thermal he mea liʻiliʻi loa lākou a he haʻahaʻa haʻahaʻa haʻahaʻa haʻahaʻa, no laila ʻoi aku ka palekana i ka hihia o ka leaks. Eia nō naʻe, ʻoi aku ka maikaʻi o kā lākou thermal conductivity, no laila e kōkua wale lākou i ka hoʻohaʻahaʻa ʻana i ka mahana 1 a 3ºC i hoʻohālikelike ʻia me kahi interface i hoʻohana ʻole ia.
    • Kalapona: ʻoi aku ka maikaʻi a me nā mea hou aku, akā hāʻawi lākou i nā hopena maikaʻi aʻe. Hoʻolālā ʻia lākou no nā ʻōnaehana e pono ai ka hoʻoheheʻe ʻana o ka wela kiʻekiʻe, e like me ka overclocked chips, nā mea hana kiʻekiʻe a i ʻole nā ​​​​mea mana kiʻekiʻe, etc. Hoʻokumu ʻia lākou ma nā ʻāpana e like me ka lepo daimana, graphene oxide, etc. I kēia hihia, ua aneane kūpono nā waiwai, no ka mea, ma kekahi ʻaoʻao he maikaʻi loa ko lākou conductivity wela e like me nā metala, a ma kekahi ʻē aʻe he haʻahaʻa haʻahaʻa lākou e like me nā seramika.
    • Metala wai: ʻAʻole ia he mea maʻamau, akā hoʻohana pinepine ʻia e kekahi mau mea hana a mea hoihoi paha no nā poloka heatsink o nā ʻāpana hana etc. ʻOiai loaʻa iā lākou nā waiwai dissipation maikaʻi, ʻoi aku ka maikaʻi ma mua o nā mea i hoʻokumu ʻia ma ka metala, ʻoi aku ke kumukūʻai o kēia ʻano ʻē aʻe a hiki ke hana me nā heatsinks alumini, no ka mea, hoʻohana lākou i nā metala e like me ka indium a i ʻole gallium.
    • ʻO Hybrids: aia kekahi mau hybrid thermal pastes, ʻo ia hoʻi, hoʻohui lākou i nā ʻāpana hoʻopihapiha like ʻole i kumu e hoʻomaikaʻi ai i nā waiwai.

He aha ka huahana e kūʻai ai?

Inā makemake ʻoe e kūʻai i kahi huahana thermal paste, eia kekahi o nā hōʻailona maikaʻi loa a me nā koho i loaʻa iā ʻoe ma ka mākeke:


Hoʻopili ka ʻike o ka ʻatikala i kā mākou kumumanaʻo o ka hoʻoponopono hoʻoponopono. E hōʻike i kahi kaomi hemahema ʻaneʻi.

E lilo i mea mua e wehewehe

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  1. He kuleana no ka ʻikepili: Miguel Ángel Gatón
  2. Ke kumu o ka ʻikepili: kaohi SPAM, hoʻokele ʻōlelo.
  3. Legitimation: Kou ʻae
  4. Ka kamaʻilio ʻana o ka ʻikepili: ʻaʻole e hōʻike ʻia ka ʻikepili i nā ʻaoʻao ʻekolu koe ka mana o ke kānāwai.
  5. Pūnaewele mālama: Pūnaewele i mālama ʻia e Occentus Networks (EU)
  6. Nā Kuleana: I kēlā me kēia manawa hiki iā ʻoe ke palena, hoʻōla a kāpae i kāu ʻike.