I-Qualcomm ibhengezwe Ihlabathi elizinzisiweyo lowama-2024 iindaba ezimbini ezibalulekileyo. Enye yazo yiQualcomm RB3 Gen 2 iqonga, i-hardware kunye nesisombululo sesoftware eyenzelwe iirobhothi, i-Intanethi yezinto (IoT), kunye nezicelo ezifakwe ngaphakathi. Eli qonga lisekelwe kwiprosesa ye-Qualcomm QCS6490.
La I-RB3 Gen 2 iqonga linika ukusebenza okuphezulu ngokubonga kwiprosesa yayo engundoqo esibhozo kunye ne-12 TOPS yobukrelekrele bokwenziwa (AI) umthamo. Ukongeza, ine-6GB ye-RAM kunye ne-128GB yokugcina ukuqinisekisa ukusebenza kakuhle kwezicelo.
Eli linyathelo elihle lokuphuhliswa kwezixhobo ezihlakaniphile kunye neerobhothi ezinamandla kunye nezisebenzayo. Kwaye, enkosi kwiQualcomm's QCS6490 SoC, inikeza umtsi omkhulu ekusebenzeni kunye nobukrelekrele bokwenziwa kwizixhobo ezizinzisiweyo. Ngelixa i-QCS6490 ingazange ikhankanywe ngaphambili, besisazi nge-QCM6490 enemodem ye-5G yee-smartphones. Ngokungafaniyo ne-QCM6490 egxile kwi-Android, i-RB6490 Gen 3 iqonga le-QCS2 liqhuba "i-Qualcomm Linux" kunye ne-LTS kernel kunye ne-software ye-IoT.
Kwaye ungayifumana le RB3 Gen 2 ukunika amandla iirobhothi, i-drones, izixhobo eziphathekayo okanye ezifakwe kwi-industrial, kunye ne-IoT, ezisa ukuphuculwa kwe-AI kula macandelo, kwaye ongayithenga ngoku ngoku-oda kwangaphambili. ukuqala kwi-399 yeedola. Ngeli xabiso uya kuba:
- Umthamo omkhulu wokuqhuba-Ihambisa i-10x ngaphezulu kwi-AI yokusetyenzwa kwesixhobo kuneqonga le-RB3 langaphambili.
- Inkxaso yeekhamera ezininzi kunye nombono womatshini: ikuvumela ukuba usebenzise i-8MP+ quad sensors zekhamera kwaye uqhube imifanekiso ngombono wekhompyuter.
- uqhagamshelwano oluphambili- Idibanisa i-Wi-Fi 6E yoqhagamshelwano olungenazingcingo olukhawulezayo.
- Ukuhambelana okubanzi-Isebenza kwi-Qualcomm Linux kunye nenkxaso ye-Android ilindeleke kwixesha elizayo. Ukongeza, ibonelela ngee-SDK ezininzi zophuhliso.
- Ubomi obude obuluncedo: I-Qualcomm iqinisekisa iminyaka eli-15 yenkxaso ye-QCS6490 processor, phantse njengeetshiphusi zebanga lemoto…
Iimpawu zobuchwephesha be-Qualcomm RB3 Gen 2
Ngokuphathelele Ukucaciswa kobugcisa Kule bhodi yeQualcomm RB3 Gen 2, kufuneka siqaqambise oku kulandelayo:
- I-SoC:
- I-Qualcomm QCS6490 ene-8 ARM processing cores ene-Kryo microarchitecture, Adreno GPU kunye neHexagon DSP AI accelerator.
- Inkumbulo eyintloko:
- I-6 GB ye-LPDDR4x RAM (iphakheji ye-UMCP)
- Ukugcina:
- I-128GB UFS Flash (iphakheji ye-UMCP)
- MicroSD ikhadi slot
- PCIe ukwandiswa slot for NVMe SSD
- Bonisa
- Isidibanisi seHDMI
- USB Type-C ngenkxaso DP
- iDP encinci
- Ukwandiswa kweDSI
- Ukuya kuthi ga kwi-2x izikrini ngaxeshanye
- Ikhamera:
- Ikhithi engundoqo: 2x C-PHY/D-PHY 30-pin yokwandiswa kwebhodi
- I-Vision Kit: 1x IMX577 D-PHY 12 MP, 1x OV9282 D-PHY 1 MP enebhuleki, kunye ne-D-PHY eyongezelelweyo kunye ne-GMSL port yokwandisa
- evakalayo
- Ikhithi engundoqo: 1x DMIC, 2x iamplifiers digital, I2S/Soundwire/DMIC isantya esisezantsi isidibanisi
- Vision Kit: 4x DMIC, 2x iamplifiers digital, I2S/Soundwire/DMIC isantya esisezantsi isidibanisi
- Nets
- Uhlobo olungenacingo 802.11ax WiFi 6E ene-DBS ukuya kuthi ga kwi-3.6 Gbps
- Bluetooth 5.2 ngenkxaso LE audio
- Ii-eriyali ezi-2x eziprintwe kwi-PCB, i-RF yokwandisa isidibanisi kwii-eriyali ozikhethelayo zangaphandle
- Izibuko le-USB:
- 1x USB 3.0 Uhlobo-C
- 1x USB 2.0 w/OTG
- 2x USB 3.0 Uhlobo-A
- 1x USB 3.0 Hi-Speed
- Ujongano lwePCIe:
- I-1x PCIe Gen 3 2-layini yokwandisa
- 1x PCIe Gen 3 1-layini yokwandisa ozikhethelayo
- Izixhobo:
- I-Core Kit: I-IMU edibeneyo (ICM-42688), ukwandiswa okongezelelweyo
- I-Vision Kit: I-IMU (ICM-42688), inzwa yoxinzelelo (ICP-10111), inzwa yemagnethi / ikhampasi (AK09915), ukwandiswa okongezelelweyo
- Ulwandiso:
- Iziqhagamshelo ezisezantsi neziphezulu zeMezzanines (96boards)